Chen, Eason: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

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Підтримати

Книги
Статті (46)
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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Evaluation of Ag wire reliability on fine pitch wire bonding

Xi, Jiaqing, Mendoza, Norbe, Chen, Kevin, Yang, Thomas, Reyes, Edward, Bezuk, Steve, Lin, Juln, Ke, Shenggin, Chen, Eason

Рік:

2015

Мова:

english

Файл:

PDF, 839 KB

english, 2015

Determinants of state equity ownership, and its effect on value/performance: China's privatized firms

Alex Ng, Ayse Yuce, Eason Chen

Журнал:

Pacific-Basin Finance Journal

Рік:

2009

Мова:

english

Файл:

PDF, 638 KB

english, 2009

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thermal analysis of plastic heat sink for high power LED lamp

Huang, Leo, Chen, Eason, Lee, Daniel

Рік:

2012

Мова:

english

Файл:

PDF, 964 KB

english, 2012

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - ELK delaminate improvement methodology on Cu pillar interconnect BOP structure

Chang, Nistec, Lan, Albert, Liao, Mark, Chen, Eason

Рік:

2014

Мова:

english

Файл:

PDF, 1.28 MB

english, 2014

Aluminum nitride thin film growth and applications for heat dissipation

Bian, Yingbin, Liu, Moning, Ke, Genshui, Chen, Yigang, DiBattista, Jim, Chan, Eason, Yang, Yimou

Журнал:

Surface and Coatings Technology

Рік:

2015

Мова:

english

Файл:

PDF, 696 KB

english, 2015

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - CSP package and ball design for board level characteristic

Yu Po Wang,, Lin, Vito, Chen, Eason, Lee, Daniel

Рік:

2011

Мова:

english

Файл:

PDF, 1.72 MB

english, 2011

Relationship between changes in colour and pigment content during spathe regreening of Zantedeschia ‘Best Gold’

Jianyu Chen, Keith A. Funnell, David H. Lewis, Jocelyn R. Eason, David J. Woolley

Журнал:

Postharvest Biology and Technology

Рік:

2012

Мова:

english

Файл:

PDF, 759 KB

english, 2012

A multiproxy lake record from Inner Mongolia displays a late Holocene teleconnection between Central Asian and North Atlantic climates

Huei-Fen Chen, Sheng-Rong Song, Teh-Quei Lee, Ludvig Löwemark, Zhenqing Chi, Yong Wang, Eason Hong

Журнал:

Quaternary International

Рік:

2010

Мова:

english

Файл:

PDF, 2.47 MB

english, 2010

Echo characters and sedimentary processes along a rifting continental margin, northeast of Taiwan

Eason Hong, I Shih Chen

Журнал:

Continental Shelf Research

Рік:

2000

Мова:

english

Файл:

PDF, 428 KB

english, 2000

The high prevalence of Legionella pneumophila contamination in hospital potable water systems in Taiwan: implications for hospital infection control in Asia

Pei-Yi Yu, Yusen Eason Lin, Wei-Ru Lin, Hsiu-Yun Shih, Yin-Ching Chuang, Ren-Jy Ben, Wen-Kuei Huang, Yao-Shen Chen, Yung-Ching Liu, Feng-Yee Chang, Muh-Yong Yen, Ching-Chuan Liu, Wen-Chien Ko, Hsi-Hsu

Журнал:

International Journal of Infectious Diseases

Рік:

2008

Мова:

english

Файл:

PDF, 226 KB

english, 2008

Cytokinin and gibberellin delay regreening of spathe tissue of Zantedeschia ‘Best Gold’

Chen, Jianyu, Funnell, Keith A., Lewis, David H., Eason, Jocelyn R., Woolley, David J.

Журнал:

Postharvest Biology and Technology

Рік:

2013

Мова:

english

Файл:

PDF, 1.12 MB

english, 2013

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Capability evaluation and validation of FC chip scale package structure

Liu, Kenet, Chen, Eason, Lee, Daniel, Ma, Mike

Рік:

2011

Мова:

english

Файл:

PDF, 1.78 MB

english, 2011

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - The Improvement Guidelines of BGA Warpage within SMT Temperature Profile Using Shadow Moiré Technique

Yen, Freedman, Chen, Eason, Lai, Jeng Yuan, Wang, Yu Po

Рік:

2007

Мова:

english

Файл:

PDF, 2.22 MB

english, 2007

[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - High Power CSP Thermal Solutions

Wang, Mingzong, Chen, Eason, Lai, Jeng Yuan, Wang, Yu-Po

Рік:

2007

Мова:

english

Файл:

PDF, 1.72 MB

english, 2007

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Thermal Evaluations of FCBGA With Embedded Hot Spot Designs

Chen, Eason, Lai, Jeng, Wang, Yu-po, Hsiao, C.s.

Рік:

2006

Мова:

english

Файл:

PDF, 3.80 MB

english, 2006

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Thermal Investigation for Multiple Chips 3D Packages

Chen, M. W., Chen, Eason, Lai, Jeng-Yuan, Wang, Yu-Po

Рік:

2008

Мова:

english

Файл:

PDF, 4.61 MB

english, 2008

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Package characterization on advanced NBA-QFN structure

Lin, Vito, Chen, Eason, Lee, Daniel, Chen, Carl

Рік:

2010

Мова:

english

Файл:

PDF, 678 KB

english, 2010

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Thermal Investigations of 3D FCBGA Packages with TSV Technology

Kuo, Wei-Shen, Wang, Mingzong, Chen, Eason, Lai, Jeng-Yuan, Wang, Yu-Po

Рік:

2008

Мова:

english

Файл:

PDF, 2.61 MB

english, 2008

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - The Introduction of Warpage Improvement Guidelines for BGA's Performance within SMT Temperature Profile

Yen, Freedman, Chen, Eason, Lai, Jeng Yuan, Wang, Yu Po

Рік:

2008

Мова:

english

Файл:

PDF, 4.01 MB

english, 2008

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Warpage and stress characteristic analyses on wire-bond-S-FCCSP structure

Vito Lin,, Eason Chen,, Don Son Jiang,, Yu Po Wang,

Рік:

2009

Мова:

english

Файл:

PDF, 1.90 MB

english, 2009

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Thermal Solutions for Multi-chip Chip Scale Packages

Chen, M. W., Chen, Eason, Lai, Jeng-Yuan, Wang, Yu-Po

Рік:

2008

Мова:

english

Файл:

PDF, 3.65 MB

english, 2008

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Warpage and Stress Characteristic Analyses on Package-on-Package (PoP) Structure

Tzeng, Yuan Lin, Kao, Nicholas, Chen, Eason, Lai, Jeng Yuan, Wang, Yu Po, Hsiao, C.S.

Рік:

2007

Мова:

english

Файл:

PDF, 428 KB

english, 2007

[IEEE 2006 International Microsystems, Package, Assembly Conference Taiwan - Grand Formosa Regent, Taipei, Taiwan (2006.10.18-2006.10.20)] 2006 International Microsystems, Package, Assembly Conference Taiwan - Stress and Thermal Characteristic Analyses for Advanced FCBGA Packages

Tzeng, Yuan, Chen, Eason, Lai, Jeng, Wang, Yu, Hsiao, C.s.

Рік:

2006

Мова:

english

Файл:

PDF, 3.30 MB

english, 2006

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Mean-time-to-crack model of microbump interconnect in FCGBA package under thermal cyclic test

Chen, Chien-Chang, Wu, Wei-Chen, Chin, Ching-Yu, Chen, Hung-Ming, Lin, Vito, Chen, Eason

Рік:

2013

Мова:

english

Файл:

PDF, 888 KB

english, 2013

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Development of Through Silicon Via (TSV) interposer for memory module flip chip package

Kao, Nicholas, Chen, Eason, Lee, Daniel, Ma, Mike

Рік:

2012

Мова:

english

Файл:

PDF, 2.82 MB

english, 2012

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Stress evaluations in micro bump structures of FCBGA

Wan Yu Huang,, Eason Chen,, Don San Jiang,, Yu Po Wang,, James Chiang,, Fang Lin Tsai,, Roben Huang,, Eve Lee,, Ivan Chang,

Рік:

2009

Мова:

english

Файл:

PDF, 1.74 MB

english, 2009

[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Stress evaluations in Micro Bump structures of FCBGA

Wan Yu Huang,, Eason Chen,, Jeng Yuan Lai,, Yu Po Wang,

Рік:

2008

Мова:

english

Файл:

PDF, 1.39 MB

english, 2008

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - POP package (Cavity BGA) warpage improvement and stress characteristic analyses

Wei-Shen Kuo,, Yuan Lin Tzeng,, Eason Chen,, Jeng Yuan Lai,, Yu Po Wang,, Hsiao, C. S.

Рік:

2007

Мова:

english

Файл:

PDF, 291 KB

english, 2007

The Influence of the Beach Environment on the Digging Success and Nest Site Distribution of the Green Turtle, Chelonia mydas, on Wan-an Island, Penghu Archipelago, Taiwan

Chen, Ho-Chang, Cheng, I-Jiunn, Hong, Eason

Журнал:

Journal of Coastal Research

Рік:

2007

Мова:

english

Файл:

PDF, 210 KB

english, 2007

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A lead-frame pre-mold coreless substrate development

Lan, Chang-Yi Albert, Hsiao, C S, Tsai, Jensen, Chen, Eason, Hung, Otis

Рік:

2013

Мова:

english

Файл:

PDF, 1.21 MB

english, 2013

A Hybrid Dry-Wet Approach for Removal of a Dummy Polysilicon Gate in a Replacement Metal Gate Scheme

Hwang, Guang Yaw, Liao, J.H., Tzou, S.F., Lin, Mark, Yeh, Autumn, Lou, David, Chen, Eason, Huang, Weien, Kamarthy, Gowri, Xu, Kai Dong, Athayde, Amulya

Журнал:

Solid State Phenomena

Рік:

2012

Мова:

english

Файл:

PDF, 865 KB

english, 2012

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Structure reliability and characterization for FC package w/Embedded Trace coreless Substrate

Chen, Eason, Lan, Albert, You, Jack, Liao, Mark

Рік:

2014

Мова:

english

Файл:

PDF, 196 KB

english, 2014

High-Voltage Breakdown and the Gunn Effect in GaAs/AlGaAs Nanoconstrictions

Chen, Rui, Gao, Weilu, Wang, Xuan, Aizin, Gregory R., Mikalopas, John, Arikawa, Takashi, Tanaka, Koichiro, Eason, David B., Strasser, Gottfried, Kono, Junichiro, Bird, Jonathan P.

Журнал:

IEEE Transactions on Nanotechnology

Рік:

2015

Мова:

english

Файл:

PDF, 514 KB

english, 2015

Electroluminescence from GaAs/AlGaAs Heterostructures in Strong in-Plane Electric Fields: Evidence for k - and Real-Space Charge Transfer

Gao, Weilu, Wang, Xuan, Chen, Rui, Eason, David B., Strasser, Gottfried, Bird, Jonathan P., Kono, Junichiro

Журнал:

ACS Photonics

Рік:

2015

Мова:

english

Файл:

PDF, 1.86 MB

english, 2015

Regreening in spathes of Zantedeschia after anthesis: its physiology and control by fructification and hormones

Chen, Jianyu, Funnell, Keith A., Lewis, David H., Eason, Jocelyn R., Woolley, David J.

Журнал:

Physiologia Plantarum

Рік:

2015

Мова:

english

Файл:

PDF, 1.28 MB

english, 2015

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Alternative fine pitch solution of low cost and high throughput thermal compression bonding by using capillary underfill

Tsai, Mike, Lan, Albert, Yao, Yan Han, Wu, Meng Yueh, Chang, Cheng Kai, Lo, Roger, Chen, Eason

Рік:

2015

Мова:

english

Файл:

PDF, 1.35 MB

english, 2015

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Flip chip die attach flux evaluation method

Liu, Adam, Lo, Tank, Li, James, Chen, Eason, Yang, J Z, Chen, C T

Рік:

2014

Мова:

english

Файл:

PDF, 179 KB

english, 2014

Influence of sputtering atmosphere on crystal quality and electrical properties of zirconium aluminum nitride thin film

Ke, Genshui, Tao, Yuan, He, Zhenni, Guo, Haibo, Chen, Yigang, DiBattista, Jim, Chan, Eason, Yang, Yimou

Журнал:

Surface and Coatings Technology

Рік:

2015

Мова:

english

Файл:

PDF, 987 KB

english, 2015

The Influence of the Beach Environment on the Digging Success and Nest Site Distribution of the Green Turtle, Chelonia mydas, on Wan-an Island, Penghu Archipelago, Taiwan

Ho-Chang Chen, L-Jiunn Cheng and Eason Hong

Журнал:

Journal of Coastal Research

Рік:

2007

Мова:

english

Файл:

PDF, 1.43 MB

english, 2007

ABAXIAL AND ADAXIAL SURFACES OF SPATHE TISSUE OF ZANTEDESCHIA DIFFER IN THEIR PATTERN OF RE-GREENING

Chen, J., Funnell, K.A., Woolley, D.J., Lewis, D.H., Eason, J.R.

Журнал:

Acta Horticulturae

Рік:

2009

Мова:

english

Файл:

PDF, 522 KB

english, 2009

[ASME ASME 2008 International Mechanical Engineering Congress and Exposition - Boston, Massachusetts, USA (October 31–November 6, 2008)] Volume 6: Electronics and Photonics - Cu Pillar Bump FCBGA Package Design and Reliability Assessments

Kao, Nicholas, Hu, Yen-Chang, Tseng, Yuan-Lin, Chen, Eason, Lai, Jeng-Yuan, Wang, Yu-Po

Рік:

2008

Мова:

english

Файл:

PDF, 287 KB

english, 2008

[ASME ASME 2008 International Mechanical Engineering Congress and Exposition - Boston, Massachusetts, USA (October 31–November 6, 2008)] Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C - Thermal Performance Improvement of Through Silicon Via (TSV) Technology on 3-D Stack Packages

Kuo, Wei-Shen, Wang, Mingzong, Chen, Eason, Lai, Jeng-Yuan, Wang, Yu-Po

Рік:

2008

Мова:

english

Файл:

PDF, 252 KB

english, 2008

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Heat Transfer, Volume 3 - Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem

Chen, Eason, Lai, Jeng Yuan, Wang, Yu-Po, Hsiao, C. S.

Рік:

2006

Мова:

english

Файл:

PDF, 1.29 MB

english, 2006

Dynamic Optimization for Grade Transition Processes using Orthogonal Collocation on Molecular Weight Distribution

Ma, Yannan, Chen, Xi, Eason, John P., Biegler, Lorenz T.

Журнал:

AIChE Journal

Рік:

2019

Мова:

english

Файл:

PDF, 1.84 MB

english, 2019

THE INTRODUCTION OF A NOVEL VIRTUAL REALITY TRAINING SYSTEM FOR GYNECOLOGY LEARNING AND ITS USER EXPERIENCE RESEARCH

Chang, Chen-Wei, Yeh, Shih-Ching, Li, Mengtong, Yao, Eason

Журнал:

IEEE Access

Рік:

2019

Файл:

PDF, 7.51 MB

2019

Operational Optimization of Polymerization Reactors with Computational Fluid Dynamics and Embedded Molecular Weight Distribution Using the Iterative Surrogate Model Method

Kong, Jing, Eason, John P., Chen, Xi, Biegler, Lorenz T.

Журнал:

Industrial & Engineering Chemistry Research

Рік:

2020

Файл:

PDF, 708 KB

2020